DayOne gets up to E1bn mezzanine financing for Finland DC
Singapore-based datacentre developer and operator DayOne Data Centers (DayOne) has obtained a E500m (US$582m) mezzanine financing facility, expandable up to E1bn, according to a company press release.
TMT Finance has been reporting on this deal since April 2025, when the datacentre company, formerly known as GDS International, was looking to expand operations to Finland. However, as early as June 2024, TMT Finance reported that DayOne was expanding into Europe.
| Updates | TMT Finance | Timeline to announcement |
|---|---|---|
| DayOne exploring European expansion | 7 June 2024 | 549 days |
| Finland identified for DC project, land acquisition underway | 8 April 2025 | 244 days |
| Up to US$1bn mezzanine financing under consideration | 29 April 2025 | 223 days |
| Brookfield in talks to lend, DayOne’s advisor named | 19 June 2025 | 172 days |
| Commercial banks approached to support Finland DC project | 14 November 2025 | Exclusive to TMT Finance |
| Offtaker named | 14 November 2025 | Exclusive to TMT Finance |
The mezzanine facility, backed by Brookfield Asset Management and a global sovereign investor, is secured against DayOne’s Finland platform and carries a seven-year tenor. Proceeds will be allocated to hyperscale developments in Lahti and Kouvola, with scope for use in other markets, DayOne said.
The new financing adds to its US$1.9bn raised in Series A and Series B equity rounds. In August 2025, DayOne announced a E1.2bn investment commitment in Lahti, and together with its JV campus in Kouvola, has close to 300MW of datacentre capacity under development in Finland, the release added.
DayOne was established in May 2022 by GDS Holdings and initially focused on a tri-market hub spanning Singapore, Johor in Malaysia and Indonesia’s Riau Islands. The company has since expanded into Tokyo, Greater Bangkok and Hong Kong, alongside its entry into Finland.
TMT Finance subscribers can read our full, exclusive reporting on this deal via our intelligence platform.
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